VPO-600 Vaccum Pressure Oven

Application Fields:

SEMICONDUCTOR PACKAGING--DAF(Die Attach Film), Wafer-Level Packaging.

AUTOMOTIVE ELECTRONICS--ECU(Electronic Control Unit), Sensors, Automotive Lighting Modules.

AI SERVERS--GPU Module/Al Accelerator Card/HBM PackageServer Motherboard/OAM Module/HBM Module.

CONSUMER ELECTRONICS--Smartphones/Tablets/Laptops/Wearable Devices.

NEW ENERGY--Power Battery, Energy Storage Modules.

OPTICAL COMMUNICATIONS--Optical Transceiver, Silicon Photonics Module, Laser Module.

AEROSPACE & DEFENSE--Avionics, Military Electronic Components.

MEDICAL ELECTRONICS--Medical Sensors, Endoscopes,Implantable Electronic Devices.

KEY FEATURES

Equipped with a dual vacuum and pressure mode switching system, supporting a pressure setting range of -1~8 kg/am2. Multi-stage vacuum and pressure profiles can be programmed and automatically switched according to process requirements.

Adopts a water-cooled equal-pressure motor combined with a high-pressure blower to provide forced hot air circulation. The mainheater and auxliary heater work together for composite temperature control. The return air duct can be optionally equipped witha HEPA high-efficiency filtration system.

Built-in circulating air water-cooling system and independent chamber rapid cooling system work together to achieve dual coolingpertormance and improve cooling efficiency.

Equipped with a PC+ PLC intelligent control architecture, supporting multiple process recipe storage and one-click recipe recall. Optional MES integration and SECS/GEM communication protocol are available for smart factory connectivity.

Integrated with dual electronic and mechanical over-pressure protection, safety door interlock, sealed door safety valve, and vaporrecovery system. Multiple protection mechanisms ensure safe and stable operation.

Supports sliding automatic doors or rotary automatic doors, compatible with robotic loading and unloading for automated production lines.

HIGHLIGHTS

Superior Void Elimination for Higher Production Yield: The combination of vacuum and pressure ensures highly effective bubble removal.Vacuum expands and extracts trapped air, while subsequent positive pressurecompresses and eliminates residual microbubbles. It effectively eliminates bubbles andvoids in applications such as Die Attach Film (DAF), Potting, Underfill, Optical Clear Adhe-sive (OCA) Lamination, and Printing/ -Coating Processes, significantly improving productquality and manufacturing yield.

Smart Control for Flexible Manufacturing: Programmable multi-stage vacuum and pressure profiles,together with one-touch recipe storage and recall, allowone machine to support multiple materials and processrequirements. Fast recipe switching minimizes changeovertime, making the system ideal for high-mix, low-volumeproduction.

Precise Temperature Control with Rapid Cooling: An advanced heating system combined with multi-zonetemperature control delivers a temperature accuracy of +l°Cand a programmable heating rate of 12°C/min, ensuringexcellent process consistency across production batches.The dual water-cooling system, featuring product cooling andchamber cooling, enables rapid temperature reduction,shortens cycle time, and significantly increases Units PerHour (UPH).

Clean, Safe and Reliable Operation: Optional HEPA filtration (ISO Class 6/ISO Class 7 equivalent) together withhigh-purity nitrogen protection maintains a residual oxygen level of less than 20 ppm,effectively preventing oxidation and particle contamination.The fully welded SUS304stailess-steel chamber with smooth radiused corners minimizes particlegeneration and simplifies cleaning. Comprehensive safety features-includingmultiple over-pressure protection, safety door interlock, and volatile gas recovery-ensure reliable, stable, and long-term operation.