TS Series Semiconductor Packaging Reflow Oven

Equipment Introduction

TS Series Semiconductor Packaging Reflow Oven deliver high precision, efficiency, and intelligent performance, ideal for advanced applications in 5G, automotive electronics, medical devices, and semiconductors. With smart control, dual-lane throughput, and precision nitrogen soldering, they ensure superior soldering quality, higher productivity, and enhanced reliability to meet the demands of high-end manufacturing.

Key Features: 

• High Throughput – Conveyor speed up to 160 cm/min under normal production conditions.

• Low Energy Consumption –Equipped with a newly developed thermal management system to significantly reduce operating costs.

• Designed for High-Speed, High-Precision PCB Assembly – Optimized for advanced SMT packaging processes to meet the requirements of high-end manufacturing.

• Outstanding Temperature Control Performance– Temperature accuracy within ±1.0°C between set point and actual value, with temperature variation within ±1.5°C from no-load to full-load operation

• Rapid Warm-Up – Heating modules reach operating temperature within 15–20 minutes, minimizing standby time and reducing energy consumption.

• Advanced Thermal Insulation Design – A new insulation technology combined with an optimized chamber structure effectively reduces external surface temperature and minimizes heat loss.

• Precise Nitrogen Control –Quantitative nitrogen control with independent monitoring for each heating zone maintains oxygen concentration within 50–200 ppm.

• Advanced Cooling System – Optional multi-zone, dual-side cooling with an effective cooling length of up to 1,400 mm, ensuring rapid product cooling and low exit temperatures.

• Multi-Stage Flux Recovery System – Multiple collection points maximize flux recovery efficiency while reducing maintenance time and service frequency.

• Dual-Lane Variable-Speed Conveyor –  Independent conveyor speed control delivers twice the throughput with a single machine, reducing energy consumption by up to 65%.

• Smart Factory Ready – Supports MES integration and optional SECS/GEM communication for cloud-based reflow profile monitoring and complete process traceability.

Highlights:

Superior Temperature Control & Thermal Management

Independent Multi-Zone Temperature Control – Supports complex reflow profiles for lead-free soldering, high-temperature solder pastes, and specialty alloys such as SAC305 and BiSn.

Three-Phase Heating Technology – Three-phase heating elements deliver stable and uniform heat output for precise temperature control. Optimized load balancing minimizes electrical grid disturbance while ensuring efficient and reliable operation.

Reliable & Durable Structural Design

• High-Efficiency Heating Chamber Construction – Features 8 mm aerospace-grade aluminum flow straightening plates with a far-infrared nano coating, high-temperature-resistant chamber materials, and an extra-thick ceramic fiber insulation layer for outstanding corrosion resistance, oxidation resistance, high-temperature durability, and extended equipment service life.
• Heavy-Duty Conveyor Rails – Dual-side guide rails with special surface hardening treatment provide exceptional durability and wear resistance. An intelligent automatic lubrication system continuously lubricates the conveyor chains, ensuring reliable operation with minimal maintenance.

Intelligent Monitoring & Smart Connectivity
• Intelligent Temperature Monitoring – An optional high-precision real-time temperature monitoring system provides continuous process visibility, ensuring every degree is monitored for consistent soldering quality.
• Complete Data Traceability – Intelligent production data can be uploaded to MES systems for full process traceability, enabling transparent and smart manufacturing management. An optional SECS/GEM communication interface is available for seamless integration and efficient data exchange with semiconductor manufacturing equipment.

Full-Zone Nitrogen Coverage

Full-zone nitrogen coverage throughout the reflow chamber, achieving an oxygen concentration as low as 100 ppm.
Real-time oxygen concentration monitoring for every heating zone, providing continuous process visibility and precise control.