SMT process lecture hall: how to use the vertical curing oven to solve the PCBA warping and heat-sensitive components damage problems

Problems straight to the point:

In the SMT back-end process, especially the curing of Triple Anti Varnish, Underfill or Die Bonding, do you often encounter:

Thin and lightweight PCBAs warping and deforming after curing at high temperatures?

Heat sensitive components (e.g. connectors, sensors) degraded due to long time high temperature baking?

Uneven temperature in the oven, resulting in uneven curing effect, affecting product reliability?

The root cause of all this is likely to come from the traditional horizontal tunnel curing oven you are using.

The principle of in-depth analysis:

Traditional horizontal ovens use forced hot air circulation and PCBs are transported on rails. There are inherent disadvantages to this model:

Thermal shock: strong air convection will make the PCB localized rapid heating, due to the different coefficients of thermal expansion (CTE) of the material, the internal stress is not uniform, it is very easy to lead to board warping.

Insufficient temperature uniformity: there is a temperature difference between different locations in the furnace, and the front and rear ends of the board are not synchronized temperature rise.

Not suitable for flexible/shaped boards: Horizontal transfer requires a good leveling of the board.

Innovative advantages of vertical curing oven:

The Vertical Curing Oven solves these problems at their source through design innovation:

 "Soft air" or "natural convection" mode: our TB series vertical curing oven adopts unique vertical placement and soft heating technology, PCB boards are placed vertically in a static position, the hot air rises naturally, forming a uniform and stable temperature field, avoiding the stress impact brought by strong wind, and completely eliminating the problem of the PCB boards. Stress impact from strong wind is avoided, and thermal warpage is completely eliminated.

Excellent temperature uniformity: The vertical structure eliminates the "cold spots" and "hot spots" of the horizontal oven, ensuring that every board and every position of the board in the oven cavity is at almost exactly the same temperature, resulting in highly consistent curing quality.

Space saving: The vertical design significantly reduces the footprint of the equipment, freeing up more valuable space in the clean room. 

Conclusion

Protect sensitive components: gentler heating and precise control of maximum temperatures effectively protects components that cannot withstand the high temperatures of conventional curing ovens.

For high-end electronics manufacturing, the vertical curing oven is no longer an optional accessory, but a standard feature to improve yields and ensure product reliability. It is especially suitable for automotive electronics, aerospace, medical devices and other areas with extremely stringent quality requirements.