VRS Series Vacuum Reflow Oven

Equipment introduction

The Sun yan In-line Vacuum Reflow Oven is designed for high-reliability, high-precision soldering applications. It is ideally suited for demanding industries such as aerospace, automotive electronics, medical devices, semiconductor packaging, and defense manufacturing. Featuring a fully automated inline production solution, it delivers high-throughput manufacturing while reducing production costs. Advanced vacuum soldering technology effectively minimizes solder voids, achieving a total void area of less than 1% under optimized process conditions.

Key Features

• Designed for advanced semiconductor packaging and high-reliability reflow soldering processes, the integrated vacuum technology dramatically reduces solder voids.

•  Integrated high-sealing vacuum chamber capable of achieving vacuum levels down to 3 mbar.

• Full-process nitrogen protection combined with vacuum technology ensures optimal atmosphere control throughout the entire reflow process. 

•  Independent multi-zone precision temperature control, combined with hot-air convection and radiant heating in the vacuum chamber, accurately reproduces complex thermal profiles. 

• Multi-stage conveyor system with transfer gaps as small as 17 mm, ensuring smooth and reliable PCB transport. 

• Newly designed heating chamber with multi-layer thermal insulation effectively reduces heat loss and lowers cabinet surface temperature. 

• Fully modular design enables fast maintenance, minimizes downtime, and reduces overall service costs

  
  

 Highlights

1. Nitrogen + Vacuum Atmosphere Combined with Multi-Stage Temperature Control Process Achieves Low-Void and High-Reliability Soldering

• Integrated chamber design maintains oxygen concentration as low as 100 ppm throughout the entire reflow process

• One-piece high-sealing vacuum chamber achieves vacuum levels down to 3 mbar.

• Independent temperature control for the preheating, reflow, and vacuum zones enables precise programming of both temperature and vacuum pressure profiles.

  2.  Stable Multi-Stage Conveyor System  Ultra-Small Transfer Gaps for Seamless PCB Transport

• Aircraft-grade hardened aluminum guide rails and stainless steel roller-chain conveyors deliver outstanding transport stability and long-term reliability.

• Transfer gaps as small as 17 mm ensure seamless PCB transition between conveyor sections, virtually eliminating board jams.

• A fully modular conveyor design enables independent maintenance of the vacuum-zone transport module, minimizing downtime and simplifying service.

3. Precision Temperature Control in the Vacuum Zone   Optimized Thermal Profiles for Superior Soldering Quality

• Enhanced conductive and radiant heating technology minimizes ΔT in the vacuum zone, ensuring superior temperature uniformity across the entire assembly

• Advanced PID temperature control modules provide highly accurate and repeatable thermal profile control for demanding soldering applications.

4. Maintenance-Free Catalytic Flux Removal System

• An innovative catalytic thermal decomposition technology eliminates flux residues without relying on conventional condensation-based recovery methods, delivering maintenance-free or ultra-low-maintenance operation.

• Continuously removes and decomposes flux residues, ensuring a cleaner process atmosphere and enhanced soldering reliability.

• Clean exhaust emissions comply with environmental standards without producing secondary pollutants.

• The maintenance-free catalytic module requires only annual servicing, significantly lowering maintenance costs and maximizing equipment uptime.