Mobile Communications

Solution: For the soldering and curing process of key components such as cell phone motherboards, we provide equipment such as semiconductor reflow soldering and in-line high-clean oxygen-free vertical curing ovens. Semiconductor reflow soldering can meet the demand for high-precision soldering of tiny electronic components such as cell phone chips, ensure the quality of soldering, and avoid problems such as false soldering and short circuit. On-line high-clean oxygen-free vertical curing furnace provides an oxygen-free environment for the curing of cell phone screens and other components to prevent oxidation and ensure the uniformity and stability of the curing effect.

Benefits: help cell phone communication enterprises to improve production efficiency, shorten product production cycle, improve product quality and reliability, reduce after-sales maintenance costs, so as to occupy an advantageous position in the fierce competition in the market.