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Vertical curing oven is a specialized equipment designed for curing processes. It utilizes vertical hot air circulation to heat and rapidly cure materials (e.g. coatings, adhesives, glues). It’s widely used in industries such as new energy, smart phones, tablets, smart home appliances, automotive electronics, medical devices, and semiconductor packaging. Compared with offline curing oven and tunnel ovens, it can effectively increase production capacity, significantly reduces floor space, and offers flexibility in production line layout, especially for products with long curing time in the oven.

Customized Non-Standard Solutions, Designed for Large-Size/Heavy PCBs & Special Applications

Stable and reliable, economical and practical, good welding quality

Outstanding performance, precision and efficiency — fulfilling your dual pursuit of quality and production capacity

TS Series Semiconductor Packaging Reflow Oven deliver high precision, efficiency, and intelligent performance, ideal for advanced applications in 5G, automotive electronics, medical devices, and semiconductors. With smart control, dual-lane throughput, and precision nitrogen soldering, they ensure superior soldering quality, higher productivity, and enhanced reliability to meet the demands of high-end manufacturing.

Zero-Oxygen Precision, Powering Global Smart Manufacturing!