Industry Dynamics

1. AbstractThe purpose of this document is to provide a systematic introduction to convection reflow soldering (hereinafter referred to as reflow soldering), the core process in surface mount technology (SMT). It covers its basic principles, key equipment components, analysis of core process paramet

Problems straight to the point:In the SMT back-end process, especially the curing of Triple Anti Varnish, Underfill or Die Bonding, do you often encounter:Thin and lightweight PCBAs warping and deforming after curing at high temperatures?Heat sensitive components (e.g. connectors, sensors) degraded

Introduction:With the rapid development of electric vehicles, 5G communications and new energy industries, the third-generation semiconductors silicon carbide (SiC) and gallium nitride (GaN) are rapidly becoming the core of power devices. However, these high-performance materials also present unprec

AbstractThis document elaborates on the formation mechanism of solder voids during the reflow soldering process of Surface Mount Technology (SMT) and their severe impact on product reliability. It focuses on analyzing vacuum reflow soldering as an innovative process, including its working principl